Our non-contact end-effectors using the ultrasound air bearing technology can be installed on any common wafer handling robot. The system is suitable for any atmospheric process. The ultrasound air bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus any mechanical contact is avoided. The wafer is hovering friction-free on the supporting gas film at a height of 100 μm. Therefore 4 side-stop-pins (2 are movable) are required to transmit the lateral acceleration of the robot to the wafer. The wafer is only fixed by these pins but not clamped.
The dimensions fit to standard wafer cassettes (SEMI compatible).
30 W, 230 / 110 V
Surface materials available
4–18” /100–450 mm
The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions:
No surface damages due to non-contact handling
No particle deposition, no influence on your clean room conditions
High planarity of the substrate during transfer process
Loading / Unloading
No mechanical contact between handling-device and substrate