반도체 웨이퍼 핸들링
WGB_300  

Semiconductor Wafer-End-Effector

Our non-contact end-effectors using the ultrasound air bearing technology can be installed on any common wafer handling robot. The system is suitable for any atmospheric process. The ultrasound air bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus any mechanical contact is avoided. The wafer is hovering friction-free on the supporting gas film at a height of 100 μm. Therefore 4 side-stop-pins (2 are movable) are required to transmit the lateral acceleration of the robot to the wafer. The wafer is only fixed by these pins but not clamped.

The dimensions fit to standard wafer cassettes (SEMI compatible).

 
기술데이터
Electrical Equipment 30 W, 230 / 110 V
Surface materials available Anodized aluminium
teflon-coated aluminium
quarz-glass
Weight 1700 g
Distance (tool-substrate) 100 μm
Substrate sizes 4–18” /100–450 mm
 
제품장점
  • The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions:
  • No surface damages due to non-contact handling
  • No particle deposition, no influence on your clean room conditions
  • High planarity of the substrate during transfer process
응용분야
  • Loading / Unloading
  • Gripping
  • Flipping
중점정보
  • No mechanical contact between handling-device and substrate
  • Handling at processed / coated surfaces
  • Top-side handling (special design)
같이 사용할수 있는 제품
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