Progressive use of thin substrates is driven by technical benefits like optimized physical characteristics of the devices (heat removal, efficiency) as well as by the saving of materials.
Thin substrates are usually dimensionally instable and more sensitive towards machanical damage. Non-contact handling systems are the appropriate approach. By its unmateched homogenious distribution of handling forces Ultrasonic Suspension offers tremendous advantages.
We successfully tested our devices in applications handling substrates down to a thickness of 50 µm.
Besides significantly decrease breakage rates our systems excel due to very low energy consumption (<10%) compared to other non-contact handling technologies. This leads to remarkably decreased Cost-of-Ownership (CoO).
Of course Ultrasonic Suspension Technology can als be implemented in handling of foils and paper (e.g. in printed electronics manufacturing, packaging).
If you are interested in handling of thin substrates please contact us. >>>