
|
|
Semiconductor Wafer-End-Effector |
|
| Technical Data | ||
| Electrical Equipment | 30 W, 230 / 110 V | |
| Surface materials available | Anodized aluminium | |
| teflon-coated aluminium | ||
| quarz-glass | ||
| Weight | 1700 g | |
| Distance (tool-substrate) | 100 μm | |
| Substrate sizes | 4-18 | |
Your Benefits
- The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions:
- No surface damages due to non-contact handling
- No particle deposition, no influence on your clean room conditions
- High planarity of the substrate during transfer process
Applications
- Loading / Unloading
- Gripping
- Flipping
Highlights
- No mechanical contact between handling-device and substrate
- Handling at processed / coated surfaces
- Top-side handling (special design)
Products to be combined
