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Semiconductor Wafer-Handling
WGB_300  

Semiconductor Wafer-End-Effector

Our non-contact wafer-end-effectors use ultrasound-air-bearing technology and can be installed on any common wafer handling robot. The system is suitable for any atmospheric process. Ultrasound-air-bearing generates a supporting gas film (air or process-gas) between surfaces and substrates, therefore, any mechanical contact is avoided. Wafers hover, friction-free, on a supporting gas film at a height of 100 μm. In order to to transmit the lateral acceleration of the robot to the wafer, 4 side-stop-pins (2 are movable) are required. The wafer is only fixed by these pins, but not clamped.

The dimensions fit to standard wafer cassettes (SEMI compatible).

 

 
Technical Data
Electrical Equipment 30 W, 230 / 110 V
Surface materials available Anodized aluminium
teflon-coated aluminium
quarz-glass
Weight 1700 g
Distance (tool-substrate) 100 μm
Substrate sizes 4-18
 
Your Benefits
  • The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions:
  • No surface damages due to non-contact handling
  • No particle deposition, no influence on your clean room conditions
  • High planarity of the substrate during transfer process
Applications
  • Loading / Unloading
  • Gripping
  • Flipping
Highlights
  • No mechanical contact between handling-device and substrate
  • Handling at processed / coated surfaces
  • Top-side handling (special design)
Products to be combined
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