Our non-contact wafer-end-effectors use ultrasound-air-bearing technology and can be installed on any common wafer handling robot. The system is suitable for any atmospheric process. Ultrasound-air-bearing generates a supporting gas film (air or process-gas) between surfaces and substrates, therefore, any mechanical contact is avoided. Wafers hover, friction-free, on a supporting gas film at a height of 100 μm. In order to to transmit the lateral acceleration of the robot to the wafer, 4 side-stop-pins (2 are movable) are required. The wafer is only fixed by these pins, but not clamped.
The dimensions fit to standard wafer cassettes (SEMI compatible).
30 W, 230 / 110 V
Surface materials available
The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions:
No surface damages due to non-contact handling
No particle deposition, no influence on your clean room conditions
High planarity of the substrate during transfer process
Loading / Unloading
No mechanical contact between handling-device and substrate