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WGB_300 Chuck

Our ultrasound-air-bearing technology offers a number of important benefits when handling semiconductor-wafers in atmospheric conditions.

 

Along with the non-contact between handling devices and subustrates, the stablilization of geometrically thin substrates is significant, also top-side handling is no problem at all.

 

Minimal energy consumption (approx. 10% of aerodynamic system) is unique to ultrasound-air-bearing technology and an important step forward to Green Fab.

 

Best of all, we are able to provide you with solutions for 450 mm (18 inch) wafer handling, irrespective of wafer thickness, today.

Requirements
  • Cleanroom Compatibility
  • No Contamination
  • Thin Substrates
Applications
  • Handling
  • Chucking
  • Buffering
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