Photovoltaic Wafer-Picker-Module

Our wafer handling systems using the ultrasound air bearing can be applied in any atmospheric process. The ultrasound aur bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus, any mechanical contact is avoided. The substrate is hovering on the supporting gas-film.

Wafer Separation and Pick-Up Process

The ultrasound air bearing facilitates a separation / gripping process without any moving tool-parts. The most important advantages aside from the ultra-safe non-contact gripping are significantly lower cycle-times (higher throughput) compared to state of the art pick & place processes.

Especially adapted blowing-units singularize the uppermost wafers of the stack. Thus the topmost wafer is brought into the near-field of the ultrasound vacuum picker unit. The substrate is attracted smoothly towards the transfer unit. The distance between wafer and sonotrode is 100 - 300 μm.