Our wafer handling systems using the ultrasound air bearing can be applied in any atmospheric process. The ultrasound air bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. The wafer is hovering friction-free on the supporting gas film at a height of 100 µm. Therefore 4 side-stop-pins (2 are movable) are required to fix the wafer laterally. For higher flatness requirements (e. g. for thin-wafers) the chuck can be pre-loaded by vacuum, while the ultrasound maintains the gap.
The principle of the ultrasound air film technology
Using the ultrasound air film technology, our handling systems can be applied in any atmospheric process. The ultrasound-air-bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus, any mechanical contact is avoided. The substrate is hovering on or below the supporting gas film.
max. 30 W, 230 / 110 V~ (ultrasound)
Surface materials available
100 - 450 mm / 4 - 18
No surface damages due to non-contact handling
No particle deposition
No influence on your clean room conditions
High planarity of the substrate during transfer process
Non mechanical contact between the tool and the substrate