반도체 웨이퍼 핸들링
Chuck  

Semiconductor Wafer-Chuck


Wafer Positioning / Rotating

Our wafer handling systems using the ultrasound air bearing can be applied in any atmospheric process. The ultrasound air bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. The wafer is hovering friction-free on the supporting gas film at a height of 100 µm. Therefore 4 side-stop-pins (2 are movable) are required to fix the wafer laterally. For higher flatness requirements (e. g. for thin-wafers) the chuck can be pre-loaded by vacuum, while the ultrasound maintains the gap.

 

 

The principle of the ultrasound air film technology

Using the ultrasound air film technology, our handling systems can be applied in any atmospheric process. The ultrasound-air-bearing generates a supporting gas-film (air or process-gas) between its surface and the substrate. Thus, any mechanical contact is avoided. The substrate is hovering on or below the supporting gas film.

 
기술데이터
Electrical Equipment max. 30 W, 230 / 110 V~ (ultrasound)
Surface materials available Anodized aluminium
Teflon-coated aluminium
Quarzglas
Distance (tool-substrate) ~100 μm
Substrate sizes 100 - 450 mm / 4 - 18
 
제품장점
  • No surface damages due to non-contact handling
  • No particle deposition
  • No influence on your clean room conditions
  • High planarity of the substrate during transfer process
응용분야
  • Wafer inspection
  • Wafer processing
중점정보
  • Non mechanical contact between the tool and the substrate
  • Handling at processed / coated surfaces
  • Top-side handling (special design)
같이 사용할수 있는 제품
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